Prof. Dr.
RAZLI BIN CHE RAZAK
Mailing Address:
Deputy Vice Chancellor,
(Student Affairs and Alumni)
Universiti Malaysia Kelantan,
Kampus Bachok,
16300 Bachok, Kelantan, MALAYSIA.
Email: razlicr@umk.edu.my
November 1987 to April 1995 : Universiti Teknologi MARA (UiTM)
November 1987 - April 1995 : Lecturer. School of Mathematical and Computer Sciences.
May 1989 - May 1991 : Course Tutor. Diploma of Banking Studies and Diploma of Accountancy.
January 1994 - April 1995 : Head. Teaching and Learning Resources Unit.
May 1995 to January 2012 : Universiti Utara Malaysia (UUM)
May 1995 - November 2003 : Lecturer. Department of Operations Management. College of Business (School of Management).
December 1996 - December 1997 : Deputy Dean. Students and Staff Development, School of Management.
June 2001 to May 2002 : Deputy Dean. Students and Staff Development. Faculty of Business Management.
November 2003 - 31 January 2012 : Associate Professor (Operations Management and Quantitative Techniques). School of Technology Management and Logistic. College of Business.
January 2006 - December 2007 : Deputy Dean. Academics and Undergraduates. Faculty of Technology Management.
January 2008 - December 2008 : Dean. Undergraduate Studies College of Business.
August 2010 - January 2012 : Director. Center of International Affairs and Cooperation.
February 2012 till Present : Universiti Malaysia Kelantan (UMK)
February 2012 till Present : Professor (Operations Management and Quantitative Techniques). Faculty of Entrepreneurship and Business.
February 2012 - January 2015 : Registrar.
August 2016 - December 2019 : Universiti Malaysia Kelantan Senate Member.
Mac 2016 - December 2017 : Chief Entrepreneur Officer/Director. Universiti Malaysia Kelantan Entrepreneurship Institute (UMKEI).
January 2018 - December 2021 : Dean. Center for Postgraduate Studies.
Mac 2021 till present : Deputy Vice Chancellor, (Student Affairs and Alumni).
- Wafer Fabrication Process Technologies
- Device Characterization, Parametric and Functional Testing
- Failure Analysis, Wafer and Package Level Reliability
- Front-end and Back-end Integrated Circuits (IC) Design
- Micro Electro Mechanical Systems (MEMS) Technologies
- Solid State and Theoretical Physics